AI-ENABLED FAULT IDENTIFICATION IN ELECTRONIC CIRCUITS FOR SEMICONDUCTORS INDUSTRY
DOI:
https://doi.org/10.62643/ijerst.v21.n3(1).pp590-601Keywords:
AI, Feature Selection, Semiconductor Manufacturing, Fault Identification, Yield Optimization, Signal Noise Reduction, Process Efficiency, Causal Relationships, Cross-Validation, Data Driven Approach.Abstract
In semiconductor manufacturing, ensuring high yield rates is critical for optimizing production efficiency
and minimizing costs. However, the vast number of signals collected from sensors and process
measurement points often contain a mix of relevant information, noise, and irrelevant data, making it
challenging for engineers to identify the key factors affecting yield. Feature selection techniques are
instrumental in addressing this challenge, as they help identify the most relevant signals that significantly
impact yield. In conventional semiconductor manufacturing, engineers are inundated with an extensive
array of signals, making it cumbersome and time-consuming to pinpoint the critical factors influencing
yield excursions. This data overload often results in suboptimal process efficiency and increased
production costs. Traditional approaches were not effectively distinguished between useful information
and noise, leading to inefficient troubleshooting and reduced yield rates. Additionally, manual feature
selection processes are labour-intensive and was not uncover complex causal relationships between
variables, limiting their effectiveness in enhancing semiconductor manufacturing operations. To
overcome the limitations of the conventional approach, this study proposes the use of artificial
intelligence-based feature selection techniques. By leveraging sophisticated algorithms, the proposed
system will rank features according to their impact on semiconductor manufacturing yield. These
techniques will not only streamline the identification of crucial variables but also unveil causal
relationships within the data, providing a deeper understanding of the production process. The application
of cross-validation ensures robustness and reliable evaluation of feature relevance for predictability using
error rates. The goal is to empower engineers with a more efficient and data-driven approach to
semiconductor manufacturing, resulting in increased yield rates, reduced production costs, and shorter
learning cycles. The preliminary results presented here demonstrate the potential of this approach,
highlighting the promise of artificial intelligence in revolutionizing semiconductor manufacturing
optimization.
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